Finally, the day has come! Qualcomm has finally announced the Snapdragon 845, a chipset that has been lurking around for a while now.
As we put 2017 to an end, Qualcomm has finally showcased their next-gen chipset that aims to bring a whole lot to the table. The company is now gearing itself towards catering AI and VR with the Snapdragon 845 in future devices. AI and VR have been lurking around for a while now, and with brands like Huawei and Apple, who have AI built into their SoCs, its about time Qualcomm caught up.
Similar to Apple’s FaceID technology, the Snapdragon 845 comes with advanced depth sensing technology that would push the new security medium to the forefront on Android devices. Based on what Qualcomm is showing off regarding their new Snapdragon 845 SoC, the new chip comes with a dedicated subystem called the SPU ( Secure Processing Unit) that would be handling security features on upcoming devices.
Regarding how fast the Snapdragon 845 is, the chip maker claims that their new chip packs 30% better graphics, 30% better power efficiency and 2.5x faster display throughput thanks to revamped Adreno 630 GPU.
Regarding what devices would get the new chip would remain a mystery ready to be unfolded throughout 2017. Although, we already have a good idea of which devices would pack the Snapdragon 845 in 2018. As reported by TechCrunch, what we do know and are assured about is that Android OEMs have already got their hands on the new chip and should be preparing to showcase what their devices bring to life.